Fonte:
Platform Technology TSMC provides the foundry industry's leading advanced process technologies and design collaterals. These processes include 45nm, 55nm, 65nm, 90nm and 0.13-micron. TSMC's advanced process technology provides the optimal combination of gate density, speed, and power, making it ideal for a broad range of applications such as computing, communications, and consumer electronics. On top of each node supports logic designs, mixed-signal/RF while embedded DRAM option is available for 45nm, 65nm and 90nm. Design collaterals include TSMC internal macros and the world's largest third-party IP library portfolios.
TSMC advanced technology is significantly ahead of the ITRS roadmap. The company delivers a new advanced technology generation every two years. Each node surpasses the previous one by close to half the area and usually features 30 to 50 percent more performance, while supporting similar leakage levels. TSMC provides substantial advanced technology capacity by ramping the same node at multiple 300mm GigaFabs that, when they reach full capacity, will produce over 100,000 12-inch wafers per month.
45nm TSMC takes platform performance to the next level of density and power with the introduction of its 45nm process technology... |
| | 55nm | | | TSMC's 55nm process is a 90% linear shrink process from the 65nm process... |
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| 65nm | | | The 65nm process offers cost-effective benefits superior to the 90nm node... |
| | | 90nm | | | Since 2004, TSMC has succeeded to ramp the NexsysSM 90nm process in TSMC's state-of-the-art 12-inch fab, Fab12... |
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| 0.13µm | | | TSMC 0.13-micron process technology delivers the optimal combination of gate density, speed and power. ... |
| | | Mixed Signal/RF | | | TSMC's fully logic-compatible mixed signal/RF technology features... |
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| DFM | | | Design For Manufacturing (DFM) is the latest in a series of efforts by TSMC to empower customer innovations... |
| | | Mask Service | | | TSMC's in-house mask shop is one of the largest in the world... |
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